The equipment is used for silicon wafers, ceramics, PCB boards EMC、 Cutting and separation processing of quartz, sapphire, glass, gallium arsenide, lithium niobate, aluminum oxide, integrated circuits, separation devices, optical communication devices, and LED chips. Suitable for cutting materials of 6 inches and below.
Features:
1. Equipped with automatic image recognition function
2. Optional NCS (non-contact height measurement) function
3. Optional BBD (Blade Damage Detection) function
4. It has multiple operational functions and can be flexibly configured according to user needs
Specifications:
| Main axis | Power | 1.8kW DC/2.4kW DC |
| Speed range | 6000-60000rpm | |
| E axis | Positioning accuracy | ±30 ” |
| X axis | Feeding speed | 0.1-400 mm/s |
| Y axis | Single step accuracy lx | ±0.003mm |
| accumulation error | <0.005/160mm | |
| Z axis | Repeating accuracy | 0.002mm |
| Max. cutter dia. | 058 | |
| Microscope | multiplying power | 1.5 times, 6 times (optional) |
| Dimension | 600x900x1690mm | |
| Weight | 500kg | |
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