Caractéristiques :

1. Modular configuration
2. Automation process cycle
3. Handling 2-8 inch product
4. Ultra-high wafers support disc parallelism
5. Low/medium volume utilization for production tools
6. Industry standard safety features
7. Multi-function solution creation and automation mode
8. Data collection and export
9. Touch screen user interface

 

Advantages:

1. High-precision: wafer bonding machine has extremely high precision, and the diameter and thickness of each bonded wafer can reach the accurate standard.
2. High reliability: the key components of the wafer bonding machine are international first-class products, which ensures the high reliability of the equipment.
3. High speed: the working speed of wafer bonder is fast, and a large number of wafers can be processed in a short time.
4. High automation: the automatic control system can save manual operation, greatly improving the work efficiency.

 

Spécifications :

Chamber size	≤8 inch
Temp. range	≤300℃
Recycling time	0-60min
Voltage	220V