La force de l'IA + la substitution domestique : l'équipement intelligent à semi-conducteurs entre dans une période d'explosion technologique
Shanghai, May 20, 2025 - At the 4th Semiconductor Eco-Innovation Conference, industry experts pointed out that China's semiconductor intelligent equipment industry is facing a historic opportunity. With the deep integration of AI big models and industrial detection technology, companies such as Rilian Technology have achieved breakthroughs in integrated circuit detection accuracy through X-ray intelligent detection equipment, and their gross profit margin for related businesses in 2024 has reached 46.38%. At the same time, Linxin Investment has invested in more than 130 semiconductor projects in the past ten years and promoted IPOs of 18 companies. With the help of capital, the speed of domestic equipment technology iteration has been significantly improved.
Technological breakthroughs focus on three major directions
Intelligent detection: New X-ray equipment integrates deep learning algorithms, and the accuracy of defect recognition is increased to 99.2%, which is suitable for the detection needs of third-generation semiconductor materials such as silicon carbide
Green manufacturing: The multi-stage filtration system for grinding waste liquid achieves an impurity removal rate of 99.7%, and the energy consumption per unit of production capacity is reduced by 40% compared with 2020
Autonomy and controllability: The positioning accuracy of the dual worktable of the domestic lithography machine reaches 0.8nm, and the localization rate of key equipment for the 28nm process exceeds 65%
SEMI data shows that the scale of China's semiconductor equipment market is expected to reach 230 billion yuan in 2025, of which the growth rate of intelligent detection equipment exceeds the industry average by 5 percentage points. Wafer factories such as SMIC have accelerated the introduction of domestic equipment, driving the orders of companies such as North Huachuang and Shengmei Shanghai to increase by more than 50% year-on-year. Analysts believe that with the surge in demand for AIoT and automotive chips, semiconductor intelligent equipment will evolve in the direction of "end-cloud collaboration", and the global penetration rate of intelligent equipment is expected to exceed 42% in 2026.
