Description:

The HN-410 series laser dicing machine is equipped with imported lasers, with high processing efficiency, stable quality, and simple and easy-to-operate equipment; it provides full-cut/half-cut scribing methods for traditional rectangular GPP wafers, and can be upgraded to provide h
exagonal scribing (triangular scribing method).

The full series of products are divided into four devices:
HN-410 and HN-410Z support dicing products that are GPP products after the glass is removed from the front groove or products with marking patterns on the back of the wafer. Front-to-front scribing, does not support bottom alignment function.
HN-410D and HN-410DZ have a unique dual-light path system, providing back-side dicing solutions and back-side marking solutions for single-sided photolithography wafers. Front-to-front/back-side dicing, supports bottom alignment function.

Caractéristiques :

1. This equipment is a single-sided precision grinding equipment, which adopts advanced mechanical structure and control method, with high grinding efficiency and stable operation.

2. The whole machine adopts PLC+touch screen control system, which is simple and convenient to set equipment parameters and operate, and has high system stability.

3. The main motor adopts variable frequency speed control to realize soft start and soft shutdown of the main machine, reduce the impact of equipment operation, and reduce workpiece damage.

4. The workpiece grinding pressure adopts cylinder pressurization, and the closed-loop control of pressure is realized through electrical proportional valve control to ensure extremely high pressure accuracy and stability.

5. The upper pressure plate adopts active drive mode to ensure the uniformity of grinding processing at each station under the premise of ensuring the product grinding rate.

6. Both the grinding plate and the upper pressure plate are equipped with cooling water cooling function, which can reduce the deformation of the grinding plate surface while ensuring the maximum efficiency of the grinding fluid.

7. The equipment comes with a disc finishing machine, which can ensure the disc surface flatness of 0.01mm after disc finishing.

Spécifications :

Machine model	HN-410
Dicing products	4-inch to 6-inch GPP wafers and silicon wafers
Dicing method	Isometric rectangular cutting, supporting triangular cutting (manual alignment)
Laser model	Fiber laser, maximum power 20W
Dicing speed	W250mm/s
Dicing accuracy	±0,003 mm
Dicing width	0.035-0.055mm
Dicing depth	<0.12mm
Working range	220mm*200mm
Worktable resolution	0,0005 mm
Rotating motor stroke	360° 185°
Positioning accuracy of rotating motor	30”
Z-direction positioning accuracy	0.01mm
Z-direction laser focusing stroke	20mm
Automatic alignment range	35mil-305mil
Automatic alignment accuracy	0.01mm
Dimension	760x1165x1650/940x1165x1650
Poids	750/800kg