About us

Since its establishment in 2015, Zhengzhou Henuo Machinery Co., Ltd. has rapidly grown into an outstanding company in the field of semiconductor assembling, testing, inspection and metrology machines. Our company integrates R&D, manufacturing, sales and service, and focuses on R&D and supply of wafer grinding machine, wafer thinning machine, wafer dicing machine, wafer boding machine, semiconductor inspection and metrology machine, etc.

Zhengzhou Henuo Machinery Co., Ltd. is committed to promoting the development of semiconductor intelligent equipment field, and realizes domestic substitution through independent innovation. The company has professional R&D team with high-level R&D personnel, reaching the international leading level in the fields of complete machine R&D, motion control, AI algorithm, visual system, wafer inspection, etc. Our professional sales and service team covers the whole country, providing comprehensive after-sales guarantee for customers.

With more than ten years of focus and accumulation, the Henuo has made remarkable achievements in the field of semiconductor equipment. With perfect sales and service system, excellent R&D team and high-quality product scheme, the Company continuously improves market share and customer satisfaction, and is highly recognized by the semiconductor industry. In the future, Henuo will continue to adhere to the business tenet of "customer-oriented, win-win with partners, and sharing with the team", continue to create value for customers, provide highly competitive products, help China's semiconductor industry develop prosperously, and become a leader in the field of semiconductor intelligent equipment.