Wafer substrate bonding devices are high-quality bonding machines for processing fragile semiconductor wafers such as silicon and gallium arsenide. The bonding device is designed to minimize the breakage of these expensive materials while maintaining the highest quality sample yield.
Características:
Ventajas:
Especificaciones:
Tamaño de la cámara | ≤8 pulgadas |
Rango temp. | ≤300℃ |
Tiempo de reciclaje | 0-60min |
Tensión | 220V |
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