Wafer bonding refers to the technology of connecting wafers and other devices into a new wafer by a physical method. It is a very important technology in modern semiconductor manufacturing technology, widely used in MEMS devices, solar cells, LED wafers and other fields.
Características:
Ventajas:
Especificaciones:
Tamaño de la cámara | ≤12 inch |
Rango temp. | ≤300℃ |
Tiempo de reciclaje | 0-60min |
Tensión | 220V |
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