The equipment can be used for precision cutting of 12 inch wafers and packaging bodies for integrated circuits. This model has the characteristics of fully automatic loading and unloading, high and low magnification dual lens automatic alignment, opposing dual spindle cutting, dual fluid cleaning and drying, etc. It can expand the UV irradiation unit for packaging cutting.
Merkmale:
2. Longmen structure, high rigidity, good stability
3. Standard knife breakage detection, non-contact height measurement device, automatic knife mark recognition
4. 60000 RPM high-speed air static electric spindle independently developed and produced
5. Vacuum energy saving, reducing vacuum gas consumption
6. FRC function, precise cutting water flow control, ensuring cutting quality
7. Protect workpiece adhesion after abnormal power outage
8. Safety interlock ensures the safety of operators
Spezifikationen:
| Hauptachse | Strom | 1.8kW DC |
| Geschwindigkeitsbereich | 6000-60000U/min | |
| E-Achse | Ortungsgenauigkeit | ±15 ” |
| X-Achse | Vorschubgeschwindigkeit | 0.1-1000 mm/s |
| Y-Achse | Einzelschrittgenauigkeit lx | ±0.002mm |
| Additionsfehler | <0.003/310mm | |
| Z-Achse | Wiederholgenauigkeit | 0.001mm |
| Mikroskop | Multiplikationskraft | 7.5 times |
| Max. product size | 300*300mm | |
| Dimension | 1310x1600x1860mm | |
| Gewicht | 2500kg | |
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