The machine can be used for integrated circuits QFN、 Cutting and separation processing of separation devices for optical communication devices, LED chips, optical devices, and ceramic circuit devices. Suitable for cutting and processing materials such as silicon, glass, and packaging bodies.
Merkmale:
1. Equipped with automatic image recognition function
2. Equipped with NCS (non-contact height measurement) function
3. Optional BBD (Blade Damage Detection) function
4. It has multiple operational functions and can be flexibly configured according to user needs
5. The maximum square workpiece that can be cut is 300x300
Spezifikationen:
| Main axis | Power | 1.8kW DC |
| Speed range | 6000-60000rpm | |
| E axis | Positioning accuracy | ±15 ” |
| X axis | Feeding speed | 0.1-500 mm/s |
| Y axis | Single step accuracy lx | ±0.002mm |
| accumulation error | <0.005/300mm | |
| Z axis | Repeating accuracy | 0.001mm |
| Microscope | multiplying power | 1.5 times |
| Max. product size | 300*300mm | |
| Dimension | 1085x1040x1815mm | |
| Gewicht | 1200kg | |
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