Wafer Grinding Machine

Wafer Thinning Machine

Wafer Thinning Machine

  • This equipment is mainly used for thinning materials such as silicon wafers, ceramics, germanium wafers, gallium arsenide, silicon carbide, sapphire, indium sulfide, optical glass, quartz crystals, chip plastic packaging materials, etc.

Order phone:+86-15303718061
E-mail:sales@henuo-tech.com

Detail

Features:

1. This machine adopts advanced internationally renowned brand PLC and touch screen, with high degree of automation, human-machine interface, and simple and clear operation.

2. Air pressure detection sensor. When the air pressure is less than the minimum pressure required for normal processing set by the equipment, the equipment alarms to prevent the workpiece from being sucked firmly.

3. Grinding wheel torque control. When the torque is higher than the torque generated by normal processing set by the equipment, the equipment alarms to prevent the machine accessories from being damaged by the knife due to abnormal equipment or misoperation.

4. Grinding wheel current monitoring. When the cold grinding wheel is higher than the maximum current generated by normal processing set by the equipment, the grinding wheel rebounds. The rebound distance is adjustable to prevent the grinding wheel from squeezing the workpiece and causing damage.

5. Automatic compensation of grinding wheel loss to prevent the grinding wheel from affecting the processing accuracy of the workpiece due to consumption while grinding the product.

6. The equipment can be equipped with online grinding wheel dressing function according to customer needs.

7. Online thickness measuring device can be installed according to customer needs.

 

Specifications:

Model HN-150 HN-300 HN-450 HN-550
Vacuum suction cup size Φ150mm Φ300mm Φ450mm Φ550mm
Suction cup speed 0-300rpm/min 0-300rpm/min 0-300rpm/min 0-300rpm/min
Suction cup motor power 2.2KW 380V 3phase 2.2KW 380V 3phase 2.2KW 380V 3phase 2.2KW 380V 3phase
Grating control system resolution 0.0005mm 0.0005mm 0.0005mm 0.0005mm
Grinding wheel speed 0-3000rpm/min 0-3000rpm/min 0-3000rpm/min 0-3000rpm/min
Grinding wheel motor power 5.5kw 5.5kw 5.5kw 5.5kw
Thinning parallelism ≤2um ≤3um ≤3um ≤5um
Thinning thickness error ≤2um ≤3um ≤3um ≤5um
Thinning flatness ≤2um ≤2um ≤2um ≤2um
Min. thinning thickness ≥100um ≥100um ≥100um ≥100um
Grinding wheel accuracy 1um 1um 1um 1um
Min. grinding wheel step 0.1um/s 0.1um/s 0.1um/s 0.1um/s
Dimension 1200*1250*2050mm 1200*1250*2050mm 1200*1250*2050mm 1200*1250*2050mm
Weight 1700KG 1700KG 1700KG 1700KG

 

 

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